首页> 外国专利> RAW POWDER FOR ION PLATING EVAPORATION SOURCE MATERIAL, ION PLATING EVAPORATION SOURCE MATERIAL AND METHOD FOR PRODUCING THE SAME, GAS BARRIER SHEET AND METHOD FOR PRODUCING THE SAME

RAW POWDER FOR ION PLATING EVAPORATION SOURCE MATERIAL, ION PLATING EVAPORATION SOURCE MATERIAL AND METHOD FOR PRODUCING THE SAME, GAS BARRIER SHEET AND METHOD FOR PRODUCING THE SAME

机译:用于离子镀蒸发源材料的原始粉末,离子镀蒸发源材料和其制备方法,气体阻隔片及其制备方法

摘要

PROBLEM TO BE SOLVED: To provide raw powder for an ion plating evaporation source material capable of depositing a gas-barrier film wherein generation of defective films is suppressed, the stable film deposition is attained, and the high gas barrier property of silicon nitride is sufficiently exhibited, and to provide the ion plating evaporation source material suitable for the ion plating method, and a method for producing the same, and to provide a gas barrier sheet and a method for producing the same.;SOLUTION: The raw powder of the ion plating evaporation source material contains silicon nitride having the mean particle diameter of ≤5 μm and a melting type material having the mean particle diameter of ≤5 μm. The content of the melting type material is 5 to 50 pts.wt. based on 100 pts.wt. of silicon nitride.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种用于离子镀蒸发源材料的原粉,该原粉能够沉积阻气膜,从而抑制缺陷膜的产生,获得稳定的膜沉积,并充分发挥氮化硅的高阻气性展示并提供适用于离子镀方法的离子镀蒸发源材料及其制造方法,并提供一种阻气片及其制备方法。电镀蒸发源材料包含平均粒径为±5μm的氮化硅和平均粒径为±5μm的熔融型材料。熔融型材料的含量为5至50pts.wt。基于100pts.wt。氮化硅;;版权所有(C)2010,日本特许厅

著录项

  • 公开/公告号JP2009280832A

    专利类型

  • 公开/公告日2009-12-03

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20080130872

  • 发明设计人 KISHIMOTO YOSHIHIRO;

    申请日2008-05-19

  • 分类号C23C14/24;B32B9/00;C23C14/32;

  • 国家 JP

  • 入库时间 2022-08-21 19:03:18

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