Recycling method of a substrate, a method for manufacturing a laminated wafer, and a donor substrate having been subjected to appropriate reuse

摘要

Recycling method contamination of the donor substrate which is SOLVED] recycling is greatly reduced, a manufacturing method of a laminated wafer, and providing a donor substrate which has been subjected to appropriate reuse. The first region of the substrate surface, particularly, The invention relates to a substrate having a residue of the step-shaped along the edge of the substrate, protruding to the surface of the second region of the remainder of the substrate A recycling method, lie in a plane that the first region corresponds to the plane of the surface of the second region of the remainder of the substrate, and it is chamfered towards the edge of the substrate and / or modified zone, in particular, to a method comprising the ion implantation zone. Reuse method, the surface of the substrate in the first region comprises a material removal steps that are performed to be in the position lower than the height of the reforming zone before the removal of the material. Further, the present invention, a method for manufacturing a laminated wafer using a reusable substrate, the surface of the first region, and to a reusable substrate is positioned lower than the surface of the second region. [Selection] Figure Figure 1