SEMICONDUCTOR PACKAGE PEEL TEST METHOD AND SEMICONDUCTOR PACKAGE PEEL TEST APPARATUS

摘要

PROBLEM TO BE SOLVED: To detect a peeling of a semiconductor package by a test.;SOLUTION: First inspection balls 18a and second inspection balls are disposed on a package substrate 10 and the first inspection balls 18a and the second inspection balls are connected to a wiring formed through a lowest insulation layer 19 to a top insulation layer 19. The presence or absence of the peeling is detected by detecting the electrical conducting condition between the first inspection balls 18a and the second inspection balls by applying a force toward the lower face 10b to the central position of the package substrate 10 and at the same time by applying a force toward the upper face 10a to the concave part for test pressuring 27 of the package substrate 10.;COPYRIGHT: (C)2010,JPO&INPIT