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SUBSTRATE FOR TEMPERATURE MEASUREMENTS AND METHOD FOR MEASURING HEAT TREATMENT TEMPERATURE

机译:用于温度测量的基体和用于测量热处理温度的方法

摘要

PROBLEM TO BE SOLVED: To provide a substrate for temperature measurements and a method for measuring a temperature for measuring the heat treatment temperature of 470-530°C.;SOLUTION: The substrate for temperature measurements is provided with a p-type silicon substrate to which phosphorus is implanted. The heat treatment temperature is measured from the layer resistance value of the p-type silicon substrate. The dose of phosphorus is 5×1014 to 1×1015 atom/cm2.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供用于温度测量的基板和用于测量温度的方法,以测量470-530℃的热处理温度;解决方案:用于温度测量的基板设置有p型硅基板以用于温度测量。注入了磷。根据p型硅基板的层电阻值来测量热处理温度。磷的剂量为5×10 14 至1×10 15 atom / cm 2 .;版权:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010129773A

    专利类型

  • 公开/公告日2010-06-10

    原文格式PDF

  • 申请/专利权人 RENESAS ELECTRONICS CORP;

    申请/专利号JP20080302765

  • 发明设计人 OWADA HIROSHI;TACHIKAWA MASAYUKI;

    申请日2008-11-27

  • 分类号H01L21/28;H01L21/3205;H01L23/52;

  • 国家 JP

  • 入库时间 2022-08-21 19:02:52

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