PROBLEM TO BE SOLVED: To provide a crystalline modified epoxy resin having an excellent handleability as a solid substance at room temperature and an excellent low viscosity property at a molding temperature; to provide an epoxy resin composition by which a crystalline cured product having high thermal conductivity, low thermal expansion property and excellent heat and moisture resistance can be obtained when forming a complex with an inorganic filler; and further to provide an epoxy resin cured product obtained from the epoxy resin composition.;SOLUTION: The modified epoxy resin with a crystalline property at room temperature can be obtained by reacting 100 pts.wt. of 4, 4'-dihydroxybiphenyl, 20-100 pts.wt. of a mixture of phenolic compounds containing dihydroxydiphenylmethane as a major component and epichlorohydrin. The epoxy resin composition includes (A) an epoxy resin, (B) a curing agent and (C) an inorganic filler as the major components, wherein this modified epoxy resin is used by 50 wt.% or higher as the epoxy resin component.;COPYRIGHT: (C)2010,JPO&INPIT
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