首页> 外国专利> PREDICTION METHOD OF RESIDUAL STRESS, SPRAY FILM FORMING METHOD AND DEVICE, AND RESIDUAL STRESS PREDICTING PROGRAM

PREDICTION METHOD OF RESIDUAL STRESS, SPRAY FILM FORMING METHOD AND DEVICE, AND RESIDUAL STRESS PREDICTING PROGRAM

机译:残余应力的预测方法,喷膜形成方法和装置以及残余应力的预测程序

摘要

PROBLEM TO BE SOLVED: To predict a residual stress generated during spray film formation.;SOLUTION: The residual stress generated during spray film formation for forming a film by spraying spray particles onto a substrate is predicted by performing single particle analysis processes (S3, S4) for determining the first residual stress generated when a single spray particle having the first analysis condition including a temperature and speed is allowed to collide with the substrate by numerical analysis modeled by treating the substrate as a solid Lagrange's element and the spray particle as a fluid Euler's element, and a prediction process (S5) for predicting the second residual stress generated when a plurality of spray particles are allowed to collide with the substrate under the second analysis condition including the number of spray particles per unit area by superposition of the first residual stress.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:预测在喷涂膜形成过程中产生的残余应力;解决方案:通过执行单个颗粒分析过程(S3,S4 ),用于通过数值模拟来确定当具有包括温度和速度的第一分析条件的单个喷雾粒子与基材碰撞时产生的第一残余应力,该数值分析通过将基材视为固体拉格朗日元素和将喷雾粒子视为流体来建模欧拉元件,以及用于预测在第二分析条件下允许多个喷雾颗粒与基板碰撞时产生的第二残余应力的预测过程(S5),该第二分析条件包括通过叠加第一残余物而获得的每单位面积的喷雾颗粒数版权。(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010091451A

    专利类型

  • 公开/公告日2010-04-22

    原文格式PDF

  • 申请/专利权人 TOSHIBA CORP;

    申请/专利号JP20080262510

  • 发明设计人 SAITO KAZUHIRO;WADA KUNIHIKO;TANAKA AKIRA;

    申请日2008-10-09

  • 分类号G01N19/00;C23C4/00;B05D1/08;B05D3/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:02:21

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