METHOD FOR MANUFACTURING OF LED CHIP MOUNTING BOARD, MOLDING DIE OF LED CHIP MOUNTING BOARD, LED CHIP MOUNTING LEAD FRAME, LED CHIP MOUNTING BOARD, AND LED

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing of a simple and high-reliability LED chip mounting board.;SOLUTION: This method for manufacturing of an LED chip mounting board before mounting a plurality of LED chips 90 includes steps of: bending free ends 11a and 11b of a lead frame 10 by clamping the lead frame 10 by using an upper die 50 and a lower die 60 for resin molding; and filling a space (cavity 70) formed by the upper die 50 and lower die 60 with a resin 80 while the lead frame 10 is clamped by using the upper die 50 and lower die 60.;COPYRIGHT: (C)2010,JPO&INPIT