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SURFACE-MODIFIED SUBSTRATE, METHOD FOR PRODUCING SURFACE-MODIFIED SUBSTRATE, AND SYSTEM FOR PRODUCING SURFACE-MODIFIED SUBSTRATE

机译:表面改性的基质,生产表面改性的基质的方法和系统,用于生产表面改性的基质

摘要

PROBLEM TO BE SOLVED: To provide a surface-modified substrate provided with a modified layer disposed on the substrate through a light-non-transmitting layer, to provide a method for efficiently producing the same without relating to a use thereof, and to provide a system for producing the same.;SOLUTION: The method for producing the surface-modified substrate 1 includes a step of patterning a light-non-transmitting layer 12 on the surface 11a of a substrate 11 having a light transmitting property, a step of coating the patterned surface of the light-non-transmitting layer 12 with a modifying agent to dispose a modified layer 13, a step of coating the modified layer 13 with a positive photoresist 14, a step of masking the patterned light-non-transmitting layer 12, exposing the positive photoresist 14 to light from the back side 11b of the substrate 11 and then developing the product to pattern the resist layer 14' to expose prescribed sites of the modified layer 13, a step of removing the exposed modified layer 13, and then a step of removing the resist layer 14' left on the substrate 11.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种表面改性的基材,该基材具有通过不透光层设置在基材上的改性层,提供了一种有效生产该基材的方法,而与用途无关,并且提供了一种表面改性的基材。解决方案:用于制造表面改性基板1的方法包括以下步骤:在具有透光性质的基板11的表面11a上构图不透光层12;涂覆的步骤。在不透光层12的图案化表面上设置用于设置改性层13的改性剂,用正性光致抗蚀剂14覆盖改性层13的步骤,对图案化的不透光层12进行掩膜的步骤然后,将正性光致抗蚀剂14从基板11的背面11b暴露于光下,然后显影产品以对抗蚀剂层14'进行图案化,以暴露改性层13的指定部位,曝光的改性层13,然后去除残留在基板11上的抗蚀剂层14'的步骤;版权所有:(C)2010,JPO&INPIT

著录项

  • 公开/公告号JP2010094028A

    专利类型

  • 公开/公告日2010-04-30

    原文格式PDF

  • 申请/专利权人 ULVAC JAPAN LTD;

    申请/专利号JP20080265028

  • 发明设计人 FUWA KO;KIRA ATSUSHI;

    申请日2008-10-14

  • 分类号C12M3/00;

  • 国家 JP

  • 入库时间 2022-08-21 19:01:52

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