Percolating the suffering grinding material other than the aforementioned abrasives from

摘要

PROBLEM TO BE SOLVED: To provide an abrasive liquid recycling system for a chemical and mechanical flattening device (hereinafter called a CMP device), capable of keeping the good quality of a machining surface of a semiconductor wafer and the like.;SOLUTION: This abrasive liquid recycling system for the CMP device comprises an abrasive liquid tank 2, a derivation filter 4 provided in the abrasive liquid tank 2, an abrasive liquid supplying line 21 provided with the derivation filter 4 at one end and supplying the abrasive liquid from the abrasive liquid tank 2 into the CMP device 1, an abrasive liquid returning line 22 returning the abrasive liquid from the CMP device 1 to the abrasive liquid tank 2, and an induction filter 3 provided at an end of the abrasive liquid returning line 22 and existing in the abrasive liquid tank 2. Filtering is conducted by the induction filter 3 and the derivation filter 4 in the abrasive liquid tank 2 in stages. The induction filter 3 is made by plural network structure sheets having a different network size, and abrasive articles are filtered and separated by the network structure sheets in stages. The derivation filter 4 filters and separates the abrasive articles that can not be filtered and separated by the induction filter 3.;COPYRIGHT: (C)2002,JPO