SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, SUBSTRATE FOR POWER MODULE WITH BUFFER LAYER, AND METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE WITH HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a power module with a heat sink, which can efficiently diffuse heat generated from an electronic component or the like and having high heat cycle reliability.;SOLUTION: The substrate for the power module with the heat sink includes: the substrate 10 for the power module where a circuit layer 12 is formed on one surface of an insulating substrate 11; and the heat sink 4 comprising aluminum or an aluminum alloy. A buffer layer 30 comprising an aluminum base composite material for which the aluminum or the aluminum alloy is filled in a carbonaceous member is provided between the insulating substrate 11 and the heat sink 4, wherein the thermal expansion coefficient K of the buffer layer 30 is in the relation of KcKKt for the thermal expansion coefficient Kc of the insulating substrate 11 and the thermal expansion coefficient Kt of the heat sink 4, and a skin layer 31 comprising the aluminum or the aluminum alloy is formed on the side of the heat sink 4 of the buffer layer 30.;COPYRIGHT: (C)2010,JPO&INPIT