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Method of manufacturing an electronic component using the same internal electrode layer forming alloy powder of electronic components, conductive particles, and conductive paste

机译:使用相同的内部电极层形成电子部件的合金粉末,导电颗粒和导电膏的电子部件的制造方法

摘要

PROBLEM TO BE SOLVED: To effectively prevent spheronization, electrode break, and the occurrence of cracking or the like, in which grain growth of a Ni particle at a burning step is restrained even when an internal electrode layer is made thin.;SOLUTION: The electronic component has the main body of an element comprising the internal electrode layer. The internal electrode layer comprises an alloy. The alloy contains nickel (Ni) element, and at least one kind of element chosen from ruthenium (Ru), rhodium (Rh), rhenium (Re) and platinum (Pt). The content of each component is Ni: 80 to 100 mol.% (excluding 100 mol.%), and the total of Ru, Rh, Re, and Pt: 0 to 20 mol.% (excluding 0 mol.%).;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:为了有效地防止球形化,电极破裂和破裂等现象的发生,即使将内部电极层做得很薄,也可以抑制在燃烧步骤中镍粒子的晶粒生长。电子部件具有包括内部电极层的元件的主体。内部电极层包括合金。该合金包含镍(Ni)元素,以及选自钌(Ru),铑(Rh),rh(Re)和铂(Pt)中的至少一种元素。各个成分的含量为Ni:80〜100摩尔%(不包括100摩尔%),Ru,Rh,Re和Pt的合计为0〜20摩尔%(不包括0摩尔%)。版权:(C)2007,日本特许厅&INPIT

著录项

  • 公开/公告号JP4548392B2

    专利类型

  • 公开/公告日2010-09-22

    原文格式PDF

  • 申请/专利权人 TDK株式会社;

    申请/专利号JP20060194724

  • 发明设计人 鈴木 和孝;佐藤 茂樹;

    申请日2006-07-14

  • 分类号H01G4/12;H01G4/30;H01G13;B22F1;B22F1/02;H01B1;H01B1/02;

  • 国家 JP

  • 入库时间 2022-08-21 19:00:16

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