Coating composition, porous siliceous film, method for producing porous siliceous film, and semiconductor device

摘要

There is provided a low-permittivity porous siliceous film that has high mechanical strength and is useful in an interlayer insulation film. The coating composition according to the present invention is characterized by comprising: an organic solvent and, contained in said organic solvent, 1) a polyalkylsilazane and 2) at least one organic resin component selected from the group consisting of homopolymers and copolymers of acrylic esters and methacrylic esters, group -COOH and/or group -OH being contained in at least a part of side groups contained in at least one type of the organic resin component.