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Welding ground manner and the welding ground structural null printed circuit board and the welding ground metallic parts

机译:焊接接地方式及焊接接地结构零印刷电路板及焊接接地金属零件

摘要

PROBLEM TO BE SOLVED: To provide a grounding structure capable of grounding a printed board to its body case, in a sure and stable state.;SOLUTION: The grounding structure comprises a printed board 2 where electronic components are to be mounted, and a positioning hole 2b and a soldering hole 2c are made near an attaching hole 2a; a grounding metal fitting 4, where a positioning projection 4b and a soldering pin 4a to be respectively fitted to the positioning hole 2b and the soldering hole 2c of the printed board 2 are provided projected and which is fixed to the printed board 2 by a fixing implement 5 inserted to the attaching hole 2a; a soldering means for soldering the grounding pattern of the printed board 2 and the soldering pin 4a; and a fixing implement 6 for fixing the grounding metal fitting 4 to a conductive boss 3 provided projected on the structure body case 1.;COPYRIGHT: (C)2009,JPO&INPIT
机译:解决的问题:提供一种能够在稳定且稳定的状态下将印刷电路板与其机壳接地的接地结构。解决方案:接地结构包括要安装电子组件的印刷电路板2,以及一个定位装置。在安装孔2a附近形成孔2b和焊接孔2c。接地金属配件4,其中突出设置有分别要定位到印刷板2的定位孔2b和焊接孔2c的定位突起4b和焊接销4a,并且通过固定将其固定到印刷板2工具5插入到安装孔2a中。用于焊接印刷电路板2的接地图案和焊接销钉4a的焊接装置。固定工具6,其用于将接地金属配件4固定到突出在结构体壳体1上的导电凸台3上。版权所有:(C)2009,JPO&INPIT

著录项

  • 公开/公告号JP4469403B2

    专利类型

  • 公开/公告日2010-05-26

    原文格式PDF

  • 申请/专利权人 パナソニック株式会社;

    申请/专利号JP20080314157

  • 发明设计人 平野 雅行;

    申请日2008-12-10

  • 分类号H05K7/14;H01R4/38;H01R4/64;

  • 国家 JP

  • 入库时间 2022-08-21 18:59:26

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