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And warp prevention device of a printed circuit board in the reflow apparatus, a method that warp prevention

机译:回流焊装置中的印刷电路板的防翘曲装置,防翘曲的方法

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for preventing a warp of a printed circuit board in a reflow device, that can bring support pins into point contact with the reverse side of the printed circuit board so as to minimize a contact area without using a large-scale warp preventing mechanism and that can easily and surely prevent the printed circuit board from warping.;SOLUTION: For the purpose of preventing interference on electronic components 80 already mounted on the reverse side of the printed circuit board P, at the time of its transportation inside a reflow device 2, there are arranged the support pins 36 (stopper pins 36a and support pins 36b) in an arbitrary position coordinate. In addition, the support pins 36 (support pins 36b) are brought into point contact with the reverse side of the printed circuit board P so that the contact area is minimized.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:要解决的问题:提供一种用于防止回流装置中的印刷电路板翘曲的设备,该设备可以使支撑销与印刷电路板的背面进行点接触,从而在不使用印刷电路板的情况下使接触面积最小化。大型翘曲防止机构,可以轻松可靠地防止印刷电路板翘曲。解决方案:为了防止在安装时对已经安装在印刷电路板P背面的电子组件80产生干扰,为了在回流装置2内进行输送,在任意位置坐标上配置有支撑销36(止动销36a和支撑销36b)。另外,使支撑销36(支撑销36b)与印刷电路板P的反面进行点接触,以使接触面积最小。版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4536382B2

    专利类型

  • 公开/公告日2010-09-01

    原文格式PDF

  • 申请/专利权人 株式会社日立製作所;

    申请/专利号JP20040005872

  • 发明设计人 泉 信易;

    申请日2004-01-13

  • 分类号B23K3/00;B23K1/008;H05K3/34;B23K101/42;

  • 国家 JP

  • 入库时间 2022-08-21 18:59:13

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