首页> 外国专利> Part defective place marking manner and defective place marking manner of the bump equipped part, large number being defective place marking manner

Part defective place marking manner and defective place marking manner of the bump equipped part, large number being defective place marking manner

机译:凸块装配部的零件缺陷部位标记方式和缺陷部位标记方式,多数为缺陷部位标记方式

摘要

PROBLEM TO BE SOLVED: To provide the marking method of the defective part of a component for precluding the possibility of reduction in the yield due to the occurrence of a secondary defect and also providing excellent general versatility.;SOLUTION: The marking method of a defective part of a component includes a first contact step, a moving distance setting step, and a smashing step. In the first contact step, a first reference face 51 of a pressing means 31 is brought into contact with a part of a plurality of conductors 17 in the component 11 having a defective part. In the moving distance setting step, a moving distance of the pressing means 31 in the case of smashing the part of the conductors 17 is set in advance. In the smashing step, the pressing means 31 is moved by the preset moving distance to smash the part of the conductors 17 so as to deteriorate the flatness among a plurality of the conductors 17.;COPYRIGHT: (C)2006,JPO&NCIPI
机译:解决的问题:提供一种部件的缺陷部分的标记方法,以排除由于二次缺陷的出现而导致成品率降低的可能性,并且还具有出色的通用性。部件的一部分包括第一接触步骤,移动距离设置步骤和粉碎步骤。在第一接触步骤中,使按压装置31的第一基准面51与具有缺陷部分的部件11中的多个导体17的一部分接触。在移动距离设定步骤中,预先压碎导体17的一部分的情况下的按压机构31的移动距离。在粉碎步骤中,使按压装置31移动预定的移动距离,以粉碎导体17的一部分,从而使多个导体17之间的平坦度恶化。;版权所有:(C)2006,JPO&NCIPI

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号