Observation method and the observation system by processing method and its processing system and charged beam by the charged beam

摘要

PROBLEM TO BE SOLVED: To enable analysis of improper analyses, maintenance, specification assessment through a microscopic machining at high accuracy. By specifying an irradiating region for charged beam based upon a relating distance between a standard mark measured at an optical measuring step and charged beam, and by performing micro machining in a high precision by having a specified irritating region irradiated with a charged beam machining to. SOLUTION: Making and measuring device for a standard mark consist is of an XYZθ table 26 on which a semiconductor device 100 is mounted, an applying device 230 which applies a trace liquid material 10 to a local part on a surface of the semiconductor device 100, and a heating means 220 which is hardened with the trace material 10 applied by the applying device 230 through heating. Next a two dimensional distance between a microscopic standard mark 11 and a portion 1 to be machined based upon an optical image which is observed or detected is calculated, and additionally a pipette 21, as an applying device 230 or a position alignment mark which is formed at a positioning pin terminal and on the surface of the semiconductor device 100, is detected. Furthermore, these are controlled by an using optical microscope 210 and a controller 210.