首页> 外国专利> Energizing bonding apparatus and energizing joining method

Energizing bonding apparatus and energizing joining method

机译:通电接合装置及通电接合方法

摘要

PROBLEM TO BE SOLVED: To provide an electric current bonding apparatus which can perform a uniform bonding by controlling the temperature difference caused in the joining surfaces between metallic members regardless of shapes and sizes of the metallic members to be bonded in the case of performing the electric current bonding of the metallic materials to each other.;SOLUTION: The apparatus is equipped with a plurality of the metallic members 101, 102 which can be energized, a pressurizing device which makes a pressurizing force act on the plurality of the metallic members to press the metallic members to each other, electrodes 11, 12 which are installed in the plurality of the metallic members and make pairs of a plurality of sets for heating the metallic members by resistance heat generation, a power source device 6 which supplies a current to the plurality of the sets of the electrodes, and an energization controller 5 which performs energization by switching the sets of the electrodes to energize the plurality of the electrodes from the power source device.;COPYRIGHT: (C)2008,JPO&INPIT
机译:解决的问题:提供一种电流接合装置,该电流接合装置可以通过控制在金属构件之间的接合表面中引起的温度差来进行均匀的接合,而与进行电连接的金属构件的形状和尺寸无关。解决方案:该设备配备有多个可通电的金属部件101、102,一个使压力作用于多个金属部件上以进行加压的加压装置金属元件彼此之间;电极11、12,其安装在多个金属元件中,并且成对成对地通过电阻发热来加热金属元件;多套电极11、12;将电流供给到金属元件的电源装置6。多个电极组和通电控制器5,其通过切换电极组来执行通电es可以从电源设备为多个电极供电。;版权所有:(C)2008,JPO&INPIT

著录项

  • 公开/公告号JP4520422B2

    专利类型

  • 公开/公告日2010-08-04

    原文格式PDF

  • 申请/专利权人 株式会社日立製作所;

    申请/专利号JP20060085524

  • 发明设计人 塚本 武志;粕谷 忠;

    申请日2006-03-27

  • 分类号B23K20/00;B23K20/02;B23K11/11;B23K11/24;B23K11/30;

  • 国家 JP

  • 入库时间 2022-08-21 18:58:02

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号