首页> 外国专利> Wiring repair methods and wiring repair equipment

Wiring repair methods and wiring repair equipment

机译:接线维修方法和接线维修设备

摘要

PROBLEM TO BE SOLVED: To realize repairing of the disconnected part of the wiring of an electronic circuit substrate by bringing the disconnected part of the wiring into coincidence with the size and the shape of the wiring into coincidence accurately.;SOLUTION: A method of repairing the wiring for connecting the disconnected part of the wiring includes a step of applying a masking reagent 16 over a region larger than the disconnected part 15c of the wiring part 15a of the wiring 15 formed on the electronic circuit substrate (work) W as seen in plane and irradiating with a laser beam L, a step of removing the masking reagent 16 of the wiring region 17 including the disconnected part 15c, then a step of coating the wiring region 17 from which the masking reagent 16 is removed with a metal colloid, etc. 19, a step of depositing the metal thin film 20 by irradiating the metal colloid, etc. 19 with the laser beam L to heat the metal colloid, etc. 19, and a step of connecting the disconnected part 15c.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:通过使布线的断开部分与布线的尺寸和形状准确地一致来实现电子电路基板的布线的断开部分的修复;解决方案:一种修复方法如图2所示,用于连接布线的不连续部分的布线包括在比形成在电子电路基板(工件)W上的布线15的布线部分15a的不连续部分15c大的区域上涂敷掩蔽剂16的步骤。平面并用激光束L照射,去除包括断开部分15c的布线区域17的掩蔽剂16的步骤,然后用金属胶体涂覆去除掩蔽剂16的布线区域17的步骤, 19,通过用激光束L照射金属胶体等19以加热金属胶体等来沉积金属薄膜20的步骤19,以及连接断开部分的步骤。 ed part 15c .;版权:(C)2005,JPO&NCIPI

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号