When the conservation film equipped both sides treatment copper foil and the print patchboard null which uses

摘要

PROBLEM TO BE SOLVED: To obtain a copper foil for manufacturing a high density printed wiring board excellent in reliability by boring small diameter holes in a copper clad sheet free from a dent and having no resin bonded thereto. ;SOLUTION: High output carbon dioxide laser is directly applied to a double- side treated copper foil with a protective sheet wherein a protective sheet (a) is arranged to the surface to which nickel treatment or nickel alloying treatment is applied of a double side treated copper foil (b) wherein nickel treatment (c) or nickel alloying treatment (d) is applied to at least a single surface to be at least partially bonded, a copper clad laminated sheet formed using the treated copper foil and the copper foil subjected to nickel or nickel alloying treatment of a copper clad sheet to form through-holes and/or blind viaholes to obtain a printed wiring board. By this constitution, a double-side treated copper foil which has no dent and in which through-holes and/or viaholes can be bored by the direct irradiation of carbon dioxide laser can be obtained.;COPYRIGHT: (C)2001,JPO