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Measurement of the concentration of the reducing agent in the electroless plating bath

机译:化学镀浴中还原剂浓度的测量

摘要

Concentration of the reducing agent which is in the midst of non electrolysis bathing in order to plate the first metal, is measured from influence of the reducing agent for the electrodeposition speed of the second metal. In case of the non electrolytic nickel and cobalt bath, the sample of electroless deposition bath is added to acidic copper plated solution, copper electrodeposition speed is measured cyclic voltammetry elution (CVS) due to analysis. Separate analysis of hypophosphite and dimethylamine borane is achieved by the choice resolution of the dimethylamine borane in the midst of bathing which uses the both reducing agent and in the acidic solution.
机译:从还原剂对第二金属的电沉积速度的影响来测量为了镀覆第一金属而在非电解浴中的还原剂的浓度。如果使用非电解镍和钴浴,则将无电沉积浴的样品添加到酸性镀铜溶液中,由于分析,通过循环伏安洗脱(CVS)测量铜的电沉积速度。次磷酸盐和二甲胺硼烷的分离分析是通过在浴中同时使用还原剂和酸性溶液中二甲胺硼烷的选择分辨率实现的。

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