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Measurement of the concentration of the reducing agent in the electroless plating bath
Measurement of the concentration of the reducing agent in the electroless plating bath
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机译:化学镀浴中还原剂浓度的测量
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摘要
Concentration of the reducing agent which is in the midst of non electrolysis bathing in order to plate the first metal, is measured from influence of the reducing agent for the electrodeposition speed of the second metal. In case of the non electrolytic nickel and cobalt bath, the sample of electroless deposition bath is added to acidic copper plated solution, copper electrodeposition speed is measured cyclic voltammetry elution (CVS) due to analysis. Separate analysis of hypophosphite and dimethylamine borane is achieved by the choice resolution of the dimethylamine borane in the midst of bathing which uses the both reducing agent and in the acidic solution.
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