The solid phase junction the conjugation method null titanium aluminum intermetallic compound and

摘要

PROBLEM TO BE SOLVED: To provide a joining method which shows an excellent joining strength and which loses no characteristics of respective joining materials, a titanium/aluminum intermetallic compound and a copper alloy, on the joining face.;SOLUTION: This joining method is solid phase joining between a titanium/aluminum intermetallic compound and a copper alloy by hot pressurization such as HIP. A piece of copper more than 30 μm and equal to or less than 1,000 μm is inserted into the joining face as an insert metal for the purpose of relaxing a thermal stress which is caused on the boundary because of a difference in the coefficient of thermal expansion (11 to 12×10^-6/°C) of the titanium/aluminum intermetallic compound and that (15 to 20×10^-6/°C) of the copper alloy.;COPYRIGHT: (C)2006,JPO&NCIPI