首页> 外国专利> The sulfate ion removal manner which features that sulfate ion removal manner, copper/cobalt plated liquid regenerative manner, the sulfate ion removal device and

The sulfate ion removal manner which features that sulfate ion removal manner, copper/cobalt plated liquid regenerative manner, the sulfate ion removal device and

机译:具有硫酸根离子去除方式,铜/钴镀液再生方式的硫酸根离子去除方式,硫酸根离子去除装置以及

摘要

PROBLEM TO BE SOLVED: To provide a method for removing sulfate ions where sulfate ions contained in a used copper/cobalt plating solution are effectively removed, and the updating frequency of the copper/cobalt plating solution can be reduced, to provide an apparatus for removing sulfate ions, to provide a method for regenerating a copper/cobalt plating solution, and to provide an apparatus for regenerating a copper/cobalt plating solution.;SOLUTION: A weakly basic anion exchange resin is added to a used copper/cobalt plating solution comprising sulfate ions, and the sulfate ions in the copper/cobalt plating solution and the weakly basic anion exchange resin are reacted in a reaction tank 31, thus the excessive sulfate ions are removed from the used copper/cobalt plating solution. Then, copper sulfate and/or cobalt sulfate and ammonia and/or boric acid are replenished by insufficient quantities, thus the copper/cobalt plating solution is regenerated.;COPYRIGHT: (C)2005,JPO&NCIPI
机译:解决的问题:提供一种去除硫酸根离子的方法,其中有效地去除用过的铜/钴镀覆溶液中所含的硫酸根离子,并且可以降低铜/钴镀覆溶液的更新频率,从而提供一种去除装置。硫酸根离子,以提供一种再生铜/钴电镀液的方法,并提供一种用于再生铜/钴电镀液的设备。;解决方案:将弱碱性阴离子交换树脂添加到使用过的铜/钴电镀液中,包括硫酸铜离子和铜/钴电镀液中的硫酸根离子与弱碱性阴离子交换树脂在反应槽31中反应,从而从使用过的铜/钴电镀液中除去过量的硫酸根离子。然后,以不足的量补充硫酸铜和/或硫酸钴以及氨和/或硼酸,从而使铜/钴电镀液再生。;版权所有:(C)2005,JPO&NCIPI

著录项

  • 公开/公告号JP4446157B2

    专利类型

  • 公开/公告日2010-04-07

    原文格式PDF

  • 申请/专利权人 栗田工業株式会社;

    申请/专利号JP20040056713

  • 发明设计人 古川 征弘;

    申请日2004-03-01

  • 分类号C25D21/22;

  • 国家 JP

  • 入库时间 2022-08-21 18:57:18

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