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2-layer flexible printed wiring board and manufacturing method of the two-layer flexible printed wiring board

机译:二层柔性印刷线路板及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board excellent in bending characteristics obtained from a flexible copper lining laminated board using an electrolytic copper foil.;SOLUTION: The two-layered flexible printed circuit board provided with a wire formed by etching the electrolytic copper foil on the surface of a resin film layer, wherein an initial precipitated crystal layer 1 at the time of manufacturing the electrolytic copper foil is removed from the wiring, and a normally precipitated crystal layer 2 is merely included is adopted. In addition, it is preferable that a deviation between the neutral line of a cross-section thickness in the two-layered flexible printed circuit board and that of the wiring thickness is within 5% of a total thickness in the two-layered flexible printed circuit board or the like, if the two layered flexible printed circuit board is provided with a cover lay film layer.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种挠曲性优异的挠性印刷电路板,该挠性印刷电路板由使用电解铜箔的挠性铜衬里层压板获得。在树脂膜层的表面上使用铜箔,其中,将电解铜箔的制造时的初始析出结晶层1从配线上除去,仅包含通常析出的结晶层2。另外,两层挠性印刷基板中的截面厚度的中性线与配线厚度的中性线之间的偏差优选为两层挠性印刷电路中的总厚度的5%以内。如果在两层柔性印刷电路板上设置了覆盖膜层,则应使用该板等。版权所有:(C)2007,JPO&INPIT

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