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Solid-state imaging device, a single-plate color solid-state imaging device and electronic equipment

机译:固态成像装置,单板彩色固态成像装置和电子设备

摘要

An image sensor includes an imaging area including a plurality of cells arrayed in a matrix on a semiconductor substrate, each of the cells including an avalanche photodiode, the avalanche photodiode including: an anode region buried in an upper portion of the semiconductor substrate; a cathode region buried in the upper portion of the semiconductor substrate separated from the anode region in a direction parallel to the surface of the semiconductorsubstrate;and anavalanche multiplication region defined between the anode and cathode regions, the avalanche multiplication region having an impurity concentration less than the anode and cathode regions; wherein depths of the anode and cathode regions from the surface of the semiconductor substrate are different from each other.
机译:图像传感器包括成像区域,该成像区域包括在半导体衬底上以矩阵形式排列的多个单元,每个单元包括雪崩光电二极管,该雪崩光电二极管包括:掩埋在半导体衬底的上部中的阳极区域;以及阳极区域。埋入半导体衬底上部的阴极区域在与半导体衬底的表面平行的方向上与阳极区域分开;以及在阳极和阴极区域之间限定的雪崩倍增区域,雪崩倍增区域的杂质浓度小于阳极和阴极区域;其中,阳极区域和阴极区域距半导体基板的表面的深度彼此不同。

著录项

  • 公开/公告号JP4413940B2

    专利类型

  • 公开/公告日2010-02-10

    原文格式PDF

  • 申请/专利权人 株式会社東芝;

    申请/专利号JP20070074879

  • 发明设计人 飯田 義典;

    申请日2007-03-22

  • 分类号H01L27/146;H04N5/335;H04N9/07;

  • 国家 JP

  • 入库时间 2022-08-21 18:56:59

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