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Low administering the electric plating treatment to the production mannered null metal basic material surface

机译:对生产良好的零金属基础材料表面低施电镀处理

摘要

PROBLEM TO BE SOLVED: To provide a metal plate in which hard chromium plating is applied to the surface of a metal base material, and further, the hard chromium plated layer formed by the hard chromium plating is subjected to particulate shot peening, so as to reduce or extinguish fine cracks in the hard chromium plated layer, thus the low friction properties and wear resistance of the surface in the metal base material are further improved though the same has not been realized by the original hard chromium plating, and to provide a method for producing the same.;SOLUTION: Hard chromium plating is applied to the surface of a metal base material 1 to form a hard chromium plated layer 2, and further, the hard chromium plated layer 2 is subjected to particulate shot peening treatment, thus fine cracks 3 on the surface of the metal base material 1 are reduced or extinguished.;COPYRIGHT: (C)2007,JPO&INPIT
机译:解决的问题:提供一种金属板,其中在金属基材的表面上施加了硬铬镀层,并且进一步,对由该硬铬镀层形成的硬铬镀层进行了颗粒喷丸处理,以便减少或消除了硬铬镀层中的细小裂纹,因此尽管最初的硬铬镀层还没有实现,但仍进一步改善了金属基材中表面的低摩擦性能和耐磨性,并提供了一种方法溶液:对金属基材1的表面进行硬铬镀层,形成硬铬镀层2,然后对硬铬镀层2进行微粒喷丸处理,从而使其细化。金属基材1表面的裂纹3减少或消失。版权所有:(C)2007,日本特许会计师事务所

著录项

  • 公开/公告号JP4394050B2

    专利类型

  • 公开/公告日2010-01-06

    原文格式PDF

  • 申请/专利权人 千代田第一工業株式会社;

    申请/专利号JP20050254626

  • 发明设计人 藤木 榮;鈴木 信夫;

    申请日2005-09-02

  • 分类号C25D5/48;C25D7/00;B24C1/10;

  • 国家 JP

  • 入库时间 2022-08-21 18:56:59

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