PROBLEM TO BE SOLVED: To provide a method and device for mounting by which the normal- temperature bonding method for performing surface cleaning by irradiating an energy wave is appropriately adopted more conveniently to an actual mounting process for which mass production is required and, at the same time, the tact time of the whole mounting process is shortened.;SOLUTION: The mounting method by which a plurality of objects to be bonded are bonded to each other includes a cleaning step of cleaning the surfaces of the objects by irradiating the surfaces with an energy wave, a transporting step of transporting the cleaned objects to a mounting step, and the mounting step of bonding the cleaned surfaces of the transported objects to each other at a room temperature. The mounting device is used for this method.;COPYRIGHT: (C)2001,JPO
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