WAFER SUPPORT JIG, VERTICAL HEAT TREATMENT BOAT INCLUDING WAFER SUPPORT JIG, AND METHOD FOR MANUFACTURING WAFER SUPPORT JIG

摘要

The present invention provides a wafer support jig having at least a support surface on which a treatment target wafer is mounted and supported when performing a heat treatment, wherein skewness R_sk on the support surface that supports the treatment target wafer is 0R_sk10, and 10⁰ to 10⁵ protruding objects each having a height of 2 μn or above and less than 30 μm are present within arbitrary 1 mm² without protruding objects each having a height of 30 μm or above on the entire support surface. As a result, it is provided a wafer support jig that can reduce friction or adhesion of a support surface of the wafer support jig and the wafer when performing a heat treatment to the treatment target wafer such as a semiconductor wafer in a vertical heat treatment furnace, has an appropriate size distribution of the protruding objects on the support surface, and can suppress occurrence of slip dislocation, and to provide a vertical heat treatment boat including this wafer support jig, and a method for manufacturing the wafer support jig.