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METHOD FOR RECYCLING A SUBSTRATE, LAMINATED WATER FABRICATING METHOD AND SUITABLE RECYCLED DONOR SUBSTRATE
METHOD FOR RECYCLING A SUBSTRATE, LAMINATED WATER FABRICATING METHOD AND SUITABLE RECYCLED DONOR SUBSTRATE
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机译:基质的回收方法,层状水制造方法和合适的回收捐赠者基质
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摘要
The invention relates to a method for recycling a substrate with a step-like residue in a first region of its surface, in particular along the edge of the substrate, which protrudes with respect to the surface of a remaining second region of the substrate, and wherein the first region comprises a modified zone, in particular an ion implanted zone, essentially in a plane corresponding to the plane of the surface of the remaining second region of the substrate and/or chamfered towards the edge of the substrate. To prevent the negative impact of contaminants in subsequent laminated wafer fabricating processes, the recycling method comprises a material removal step which is carried out such that the surface of the substrate in the first region is lying lower than the level of the modified zone before the material removal. The invention also relates to a laminated wafer fabricating method using the recycled substrate and to a recycled substrate in which the surface of a first region lies lower than the surface of the second region.
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