首页> 外国专利> ORGANIC ELECTRONIC DEVICE, ORGANIC ELECTRONIC DEVICE MANUFACTURING METHOD, ORGANIC ELECTRONIC DEVICE MANUFACTURING APPARATUS, SUBSTRATE PROCESSING SYSTEM, PROTECTION FILM STRUCTURE AND STORAGE MEDIUM WITH CONTROL PROGRAM STORED THEREIN

ORGANIC ELECTRONIC DEVICE, ORGANIC ELECTRONIC DEVICE MANUFACTURING METHOD, ORGANIC ELECTRONIC DEVICE MANUFACTURING APPARATUS, SUBSTRATE PROCESSING SYSTEM, PROTECTION FILM STRUCTURE AND STORAGE MEDIUM WITH CONTROL PROGRAM STORED THEREIN

机译:有机电子设备,有机电子设备的制造方法,有机电子设备的制造装置,基板处理系统,保护膜的结构以及存储有控制程序的存储介质

摘要

An organic element is protected by a protection film which has high sealing performance while relaxing a stress and does not change the characteristics of the organic element. In a substrate processing system Sys, a substrate processing apparatus 10, which includes a deposition apparatus PM1, a first microwave plasma processing apparatus PM3, and a second microwave plasma processing apparatus PM4, is arranged in a cluster structure, and an organic electronic device is manufactured by keeping a space where a substrate G moves from carry-in to carry-out in a desired depressurized state. An organic EL element is formed by the deposition apparatus PM1, butyne gas is plasmatized by microwave power by the first microwave plasma processing apparatus PM3, and an aCHx film 54 is formed adjacent to the organic EL element to cover the organic EL element. Then, silane gas and nitrogen gas are plasmatized by microwave power by the second microwave plasma processing apparatus PM4, and a SiNx film 55 is formed on the aCHx film 54.
机译:有机元件由保护膜保护,该保护膜在缓解应力的同时具有高密封性能,并且不会改变有机元件的特性。在基板处理系统Sys中,包括沉积装置PM 1 的基板处理装置 10 ,第一微波等离子体处理装置PM 3 ;和第二微波等离子体处理设备PM 4 ,以簇状结构布置,并通过在其中保持基板G从搬入移入搬出的空间来制造有机电子器件。所需的减压状态。通过沉积装置PM 1 形成有机EL元件,通过第一微波等离子体处理装置PM 3 通过微波功率使丁炔气体等离子体化,并形成aCHx膜 54 形成为与有机EL元件相邻以覆盖有机EL元件。然后,通过第二微波等离子体处理装置PM 4 以微波功率使硅烷气体和氮气等离子体化,并且在aCHx膜上形成SiNx膜 55 。 54。

著录项

  • 公开/公告号US2010243999A1

    专利类型

  • 公开/公告日2010-09-30

    原文格式PDF

  • 申请/专利权人 HIRAKU ISHIKAWA;

    申请/专利号US20080675351

  • 发明设计人 HIRAKU ISHIKAWA;

    申请日2008-08-26

  • 分类号H01L51/52;H01L51/56;B32B43/00;C23C16/513;C23C16/511;B05C11/00;B32B9/04;

  • 国家 US

  • 入库时间 2022-08-21 18:54:11

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