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METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
METHODS OF POST-CONTACT BACK END OF LINE THROUGH-HOLE VIA INTEGRATION
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机译:贯穿孔的线后接触后端方法
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摘要
Presented are methods of fabricating three-dimensional integrated circuits that include post-contact back end of line through-hole via integration for the three-dimensional integrated circuits. Another aspect of the present invention includes three-dimensional integrated circuits fabricated according to methods of the present invention.
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