METHOD OF REAR SURFACE TREATMENT, ANALYSIS METHOD OF INTEGRATED CIRCUIT FROM REAR SURFACE SIDE, AND REAR SURFACE TREATMENT APPARATUS

摘要

A method of rear surface treatment is carried out by: preparing a semiconductor device in which an integrated circuit having a plurality of electrodes is provided on the front surface of a semiconductor substrate; electrically connecting the plurality of electrodes to an anode; and electropolishing the rear surface of the semiconductor substrate by performing anodic oxidation with an electrolytic solution placed in contact with the rear surface of the semiconductor substrate.