首页> 外国专利> METHOD OF REAR SURFACE TREATMENT, ANALYSIS METHOD OF INTEGRATED CIRCUIT FROM REAR SURFACE SIDE, AND REAR SURFACE TREATMENT APPARATUS

METHOD OF REAR SURFACE TREATMENT, ANALYSIS METHOD OF INTEGRATED CIRCUIT FROM REAR SURFACE SIDE, AND REAR SURFACE TREATMENT APPARATUS

机译:后表面处理方法,后表面侧的综合电路分析方法以及后表面处理装置

摘要

A method of rear surface treatment is carried out by: preparing a semiconductor or device in which an integrated circuit having a plurality of electrodes is provided on the front surface of a semiconductor substrate; electrically con netting the plurality of electrodes to an anode; and electropolishing the rear surface of the semiconductor substrate by performing anodic oxidation with an electrolytic solution placed in contact with the rear surface of the semiconductor substrate.
机译:一种背面处理方法,其通过以下步骤进行:制备半导体或器件,其中在半导体衬底的前表面上提供具有多个电极的集成电路;将多个电极电连接到阳极;通过用与半导体衬底的后表面接触的电解液进行阳极氧化,对半导体衬底的后表面进行电抛光。

著录项

  • 公开/公告号US2010193374A1

    专利类型

  • 公开/公告日2010-08-05

    原文格式PDF

  • 申请/专利权人 HIDEKI KITAHATA;

    申请/专利号US20100700905

  • 发明设计人 HIDEKI KITAHATA;

    申请日2010-02-05

  • 分类号C25F3/12;

  • 国家 US

  • 入库时间 2022-08-21 18:53:00

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