This invention is a barrier composition comprising a resin or resin/filler system that is capable of being cured at low temperature while still maintaining superior barrier performance. This composition comprises (a) an aromatic compound having meta-substituted epoxy functionalities; (b) a multifunctional aliphatic amine; (c) optionally, one or more fillers; (d) optionally one or more adhesion promoters; (c) optionally, a phenolic cure accelerator.
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