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Patternable low dielectric constant materials and their use in ULSI interconnection
Patternable low dielectric constant materials and their use in ULSI interconnection
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机译:可图案化的低介电常数材料及其在ULSI互连中的应用
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摘要
The present invention relates to ultra-large scale integrated (ULSI) interconnect structures, and more particularly to patternable low dielectric constant (low-k) materials suitable for use in ULSI interconnect structures. The patternable low-k dielectrics disclosed herein are functionalized polymers that having one or more acid-sensitive imageable functional groups.
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