ELECTROLESS NICKEL LEVELING OF LGA PAD SITES FOR HIGH PERFORMANCE ORGANIC LGA

摘要

A structure comprises: a substrate; at least one conductor on the substrate; at least one contact pad on the substrate; a mask over the conductor (wherein the mask comprises an opening over the contact pad and wherein the mask comprises a bottom surface contacting the substrate and a top surface opposite the bottom surface); and a contact pad plating layer on the contact pad and within the opening of the mask. The contact pad plating layer comprises a bottom surface contacting the contact pad and a top surface opposite the bottom surface, and the top surface of the contact pad plating layer is coplanar with the top surface of the mask.