Fine-pitch routing in a lead frame based system-in-package (SIP) device

摘要

In an example embodiment, there is a package substrate (200) for mounting an integrated circuit (IC) device (205). The package substrate comprises an IC device placement area (290) surrounded by pad landings (215). For placing surface mount devices in vicinity of the pad landings, there is a plurality of component pads (235a, 235b, 235c, 235d). The plurality of component pads surrounds the pad landings (215). A plurality of device pins (225a, 225b, 225c, 225d, 245a, 245b, 245c, 245d) surrounds the component pads. One or more of the plurality of device pins, having fine-pitch conductive paths (270), couple the one or more of the plurality of device pins to a set of corresponding pad landings (215) or to a set of corresponding component pads; the fine-pitch conductive paths (270) traverse regions between the plurality of component pads.