LOW-PROFILE THERMOSYPHON-BASED COOLING SYSTEM FOR COMPUTERS AND OTHER ELECTRONIC DEVICES

摘要

This invention provides a cooling system comprising a thermosyphon forcomputer and electronic devices. The thermosyphon comprises an evaporatorplaced on top of a heat source, such as CPU. Heat from the heat source causesliquid coolant inside the evaporator to evaporate or boil. The resulting vaporenters a condenser and returns to a liquid phase. Cooling fins are attached tothe condenser to facilitate heat transfer with the surrounding airflow. Thecooling system and computer or electronic device fit within standard computercases and high density server rack-mountable cases.