LOW‑TEMPERATURE CURABLE RESIN COMPOSITION, COATING FILM FORMING METHOD USING SAME, RESIN MORTAR AND FIBER REINFORCED RESIN

摘要

The low‑temperature curable resin composition contains (A) a radical polymerizable resin, (B) a radical polymerizable unsaturated monomer, (C) a cobalt metal salt, (D‑1) an aromatic tertiary amine containing a hydroxyl group represented by general formula (I) (wherein, R1 is H, CH3 or OCH3; R2 is a hydroxyalkyl group, R3 is an alkyl group or a hydroxyalkyl group), (D‑2) an aromatic tertiary amine containing a hydroxyl group represented by general formula (II) (wherein, R4 is H, CH3, or OCH3, and R5 and R6 are alkyl groups independent of each other), and (E) is an organic peroxide. The low‑temperature curable resin composition can be cured in a short period of time even in a low‑temperature environment of 0°C or lower, has low odor and has excellent workability, impact resistance, and durability.