WIRE DISCHARGE-WORKING APPARATUS AND WIRE DISCHARGE-WORKING METHOD, SEMICONDUCTOR WAFER MANUFACTURING APPARATUS AND SEMICONDUCTOR WAFER MANUFACTURING METHOD, AND SOLAR CELL WAFER MANUFACTURING APPARATUS AND SOLAR CELL WAFER MANUFACTURING METHOD

摘要

Disclosed is a wire discharge-working apparatus comprising: parallel wire electrodes (2) spaced in parallel from each other and having cutting wire sections (2a) formed, at predetermined regions, to face a workpiece (8); a working power source (6) for generating a pulse-shaped working voltage; and plural feeder units (71 and 72) connected electrically, for the individual cutting wire sections (2a), with the wire electrodes (2) of the cutting wire sections (2a), to thereby apply individual working voltages between the cutting wire sections (2a) and the workpiece (8).  In the parallel cutting wire sections (2a), the feeder units (71 and 72) are arranged so that the direction of electric currents to be fed to at least some of the cutting wire sections (2a) may be different from the direction of electric currents to be fed to the other cutting wire sections (2a).