CONTINUOUS SOLID POWDER VAPOUR-DEPOSITION DEVICE, AND A CONTINUOUS SOLID POWDER VAPOUR DEPOSITION METHOD

摘要

The present invention relates to a method and a device in which a solid powder is evenly dispersed and is uniformly and continuously vapour-deposited onto a substrate in such a way that a uniform thin film can be formed. More specifically the present invention provides a method and a device for forming a thin film, in which a solid powder is vapour-deposited both evenly and continuously across an entire surface of a substrate, regardless of the material or size of the substrate, by using a nozzle to continuously inject an aerosol of predetermined density, speed and flow rate which is produced by supplying solid powder in a predetermined amount per unit time and a carrier gas at a predetermined flow rate per unit time in a carrier tube regardless of the size, consistency and specific gravity of the solid powder particles.