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VIA FIRST PLUS VIA LAST TECHNIQUE FOR IC INTERCONNECT
VIA FIRST PLUS VIA LAST TECHNIQUE FOR IC INTERCONNECT
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机译:通过VIA FIRST PLUS和VIA用于集成电路互连的最新技术
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摘要
A multi-tiered IC device contains a first die including a substrate with a first and second set of vias. The first set of vias extends from one side of the substrate, and the second set of vias extend from an opposite side of the substrate. Both sets of vias are coupled together. The first set of vias are physically smaller than the second set of vias. The first set of vias are produced prior to circuitry on the die, and the second set of vias are produced after circuitry on the die. A second die having a set of interconnects is stacked relative to the first die in which the interconnects couple to the first set of vias.
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