首页> 外国专利> MICROWAVE PLASMA PROCESSING APPARATUS, DIELECTRIC BOARD PROVIDED WITH SLOT BOARD FOR MICROWAVE PLASMA PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING DIELECTRIC BOARD

MICROWAVE PLASMA PROCESSING APPARATUS, DIELECTRIC BOARD PROVIDED WITH SLOT BOARD FOR MICROWAVE PLASMA PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING DIELECTRIC BOARD

机译:微波等离子体处理装置,具有用于微波等离子体处理装置的槽板的介电板和制造介电板的方法

摘要

Provided is a microwave plasma processing apparatus which prevents a slot board from wearing and a conductive film as the slot board from peeling from a dielectric board even when the slot board and a dielectric window are thermally expanded.A dielectric board (22) is provided with a protruding section (22c) which protrudes to the inside of a slot (23a) of a slot board (23).  Then, the surface of the protruding section (22c) of the dielectric board (22) is protruded outward from the surface of a dielectric window (12) toward the dielectric window (12).  When the slot board (23) is directly in contact with the dielectric window (12), an elongation quantity difference is generated due to the difference between the thermal expansion coefficient of the slot board (23) and that of the dielectric window (12).  By bringing the protruding section (22c) of the dielectric board (22) into contact with the dielectric window (12) and not bringing the slot board (23) into contact with the dielectric window (12), the slot board (23) is prevented from wearing and the conductive film as the slot board (23) is prevented from peeling from the dielectric board (22), even when the slot board (23) and the dielectric window (12) are thermally expanded.
机译:本发明提供一种微波等离子处理装置,即使在热膨胀缝隙基板和电介质窗的情况下,也可以防止缝隙基板的磨损和作为缝隙基板的导电膜从电介质基板剥离。电介质板(22)具有向槽板(23)的槽(23a)的内部突出的突出部(22c)。然后,电介质板(22)的突出部(22c)的表面从电介质窗(12)的表面朝向电介质窗(12)向外突出。当缝隙板(23)直接与介电窗(12)接触时,由于缝隙板(23)的热膨胀系数与介电窗(12)的热膨胀系数之间的差异而产生伸长量差异。 。通过使介电板(22)的突出部分(22c)与介电窗(12)接触并且不使插槽板(23)与介电窗(12)接触,插槽板(23)成为即使在使缝隙板(23)和介电窗(12)热膨胀的情况下,也能够防止磨损,并且防止缝隙板(23)中的导电膜从介电板(22)剥离。

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