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MICROWAVE PLASMA PROCESSING APPARATUS, DIELECTRIC BOARD PROVIDED WITH SLOT BOARD FOR MICROWAVE PLASMA PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING DIELECTRIC BOARD
MICROWAVE PLASMA PROCESSING APPARATUS, DIELECTRIC BOARD PROVIDED WITH SLOT BOARD FOR MICROWAVE PLASMA PROCESSING APPARATUS, AND METHOD FOR MANUFACTURING DIELECTRIC BOARD
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机译:微波等离子体处理装置,具有用于微波等离子体处理装置的槽板的介电板和制造介电板的方法
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摘要
Provided is a microwave plasma processing apparatus which prevents a slot board from wearing and a conductive film as the slot board from peeling from a dielectric board even when the slot board and a dielectric window are thermally expanded.A dielectric board (22) is provided with a protruding section (22c) which protrudes to the inside of a slot (23a) of a slot board (23). Then, the surface of the protruding section (22c) of the dielectric board (22) is protruded outward from the surface of a dielectric window (12) toward the dielectric window (12). When the slot board (23) is directly in contact with the dielectric window (12), an elongation quantity difference is generated due to the difference between the thermal expansion coefficient of the slot board (23) and that of the dielectric window (12). By bringing the protruding section (22c) of the dielectric board (22) into contact with the dielectric window (12) and not bringing the slot board (23) into contact with the dielectric window (12), the slot board (23) is prevented from wearing and the conductive film as the slot board (23) is prevented from peeling from the dielectric board (22), even when the slot board (23) and the dielectric window (12) are thermally expanded.
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