BERNOULLI GRIPPER APPARATUS HAVING AT LEAST ONE BERNOULLI GRIPPER

摘要

The invention relates to a Bernoulli gripper apparatus having at least one Bernoulli gripper (1) for receiving planar substrates such as silicon-based wafers (2), comprising: - a gripper body (4) which is connected to a connecting piece (3) for a robotic arm and to which – as viewed in the cross-section of the Bernoulli gripper (1) – a funnel-shaped component (12) and at least one rubberized support element (10) having a gripping surface (11) are connected, said surface ensuring non-skid displacement of a wafer (2) suctioned by the same, a flow system (23, 24, 25, 26) for compressed air, which comprises at least one inlet opening (24) and at least one outlet opening (25) and communicates by way of the latter with the gripping surface (11) of the at least one support element (10) such that, when introducing the compressed air into the at least one inlet opening (24) of the flow system (23, 24, 25, 26), a negative pressure is generated at the gripping surface (11) of the at least one support element (11) for suctioning the wafer (2) to be gripped, a damping device (21) which is adapted on the outside to the gripper body (4) and the outline of which – as viewed in the cross-section of the Bernoulli gripper (1) – protrudes beyond all remaining components (4, 5, 10, 12) of the Bernoulli gripper (1) in terms of the contours and forms such a damping resistance for the wafer (2) to be gripped during the suction-induced approach of the gripping surface (11) that the wafer (2) can be gently placed against the gripping surface (11) of the at least one support element (10). In order to keep the periphery of the Bernoulli gripper free of waste air, the at least one outlet opening (25) of the flow system (23, 24, 25, 26) for the compressed air inside the Bernoulli gripper (1) is oriented such that the compressed air current exiting therefrom in the Bernoulli gripper (1) is directed inward, wherein inwardly of the at least one outlet opening (25) of the flow system (23, 24, 25, 26) in the Bernoulli gripper (1) an extraction duct (17) that is open at the top is provided, by way of which, when the wafer (2) rests against the gripping surface (11) of the at least one support element (10), the compressed air flowing out inwardly from the at least one outlet opening (25) can be conducted upward inside the Bernoulli gripper (1) and discharged out of the same to the outside.