RESIN FOR THERMAL IMPRINTING, RESIN SOLUTION FOR THERMAL IMPRINTING, INJECTION MOLDED BODY FOR THERMAL IMPRINTING, THIN FILM FOR THERMAL IMPRINTING, AND PROCESS FOR PRODUCING THE THIN FILM

摘要

There are provided a thermal-imprinting resin which has a good heat-deterioration tolerability and a low resin elastic modulus at the time of fluidization in order to suppress any production of particle-like materials in microfabrication by thermal imprinting, and has a good fine-pattern transfer characteristic, a thermal-imprinting-resin solution using the same, a thermal-imprinting injection-molded body using the same, a thermal-imprinting thin film using the same and a production method thereof. The thermal-imprinting resin has an exothermic onset temperature (oxidation onset temperature) of an exothermic peak due to oxidation greater than or equal to + 35 °C to the glass transition temperature of the resin in differential scanning calorimetric measurement at a temperature rise rate of 5 °C/min in air, and has a complex modulus less than 0.24 MPa at the glass transition temperature of the resin + 35 °C in a dynamic viscoelastic modulus measurement at a frequency of 1 rad/sec in nitrogen stream. The thermal-imprinting-resin solution, the thermal-imprinting injection-molded body, the thermal-imprinting thin film and the production method thereof use the foregoing resin.