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Herstellungsverfahren eines Werkzeugs für Werkstücke aus nanostrukturierten Polymermaterialien
Herstellungsverfahren eines Werkzeugs für Werkstücke aus nanostrukturierten Polymermaterialien
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机译:用于由纳米结构聚合物材料制成的工件的工具的制造工艺
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摘要
The process comprise successively depositing a thin barrier layer and a thin layer (5) of quasi-diamond carbon on a part of a metal support (2), and nanostructuring the thin layer to form a nanostructured surface for contacting with polymer material. The thin layer is nanostructured according to a predetermined pattern having a ratio of form greater than 1 by forming a hard mask (8) on the free surface of the quasi-diamond carbon thin layer by a first operation of selective chemical etching in the dry phase done through a network of interstices (11) bounded by nanoparticles (10). The process comprise successively depositing a thin barrier layer and a thin layer (5) of quasi-diamond carbon on a part of a metal support (2), and nanostructuring the thin layer to form a nanostructured surface for contacting with polymer material. The thin layer is nanostructured according to a predetermined pattern having a ratio of form greater than 1 by forming a hard mask (8) on the free surface of the quasi-diamond carbon thin layer by a first operation of selective chemical etching in the dry phase done through a network of interstices (11) bounded by nanoparticles (10) previously deposited on the free surface of the hard mask, forming a predetermined pattern in the thin layer by a second operation of selective chemical etching in dry phase carried out through the hard mask, stopping the etching at the interface between the thin layer of quasi-diamond carbon and the thin barrier layer. The bilayer coating formed by the thin barrier layer and the nanostructured quasi-diamond carbon thin layer have a thickness of 100 nm to 10 mu m. The hard mask has a thickness of 10-50 nm. The pattern is constituted of many openings passing through the thin layer of quasi-diamond carbon from the free surface to the interface between the thin layer and the thin barrier layer. The thin barrier layer has a thickness of 50-500 nm.
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