首页> 外国专利> HEAT TRANSFER SHEET AND A MANUFACTURING METHOD THEREOF, CUTTING OFF PRODUCT COST OF HEAT TRANSFER SHEET BY REDUCING AMOUNT OF THE HEAT CONDUCTION PARTICLE

HEAT TRANSFER SHEET AND A MANUFACTURING METHOD THEREOF, CUTTING OFF PRODUCT COST OF HEAT TRANSFER SHEET BY REDUCING AMOUNT OF THE HEAT CONDUCTION PARTICLE

机译:传热板及其制造方法,通过减少传热颗粒的量来削减传热板的产品成本

摘要

PURPOSE: A heat transfer sheet and a manufacturing method thereof are provided to improve the heat conduction characteristic by evenly arranging the heat conduction part with a gap.;CONSTITUTION: A heat transfer sheet(10) is arranged between the semiconductor device and the heat sink. The heat transfer sheet transfers the heat of the semiconductor device to the heat sink. The heat sink rapidly emits the heat generated from the semiconductor device to outside. The heat conduction parts are separated each other in perpendicular with the thickness direction. The heat conduction parts are arranged in a line. The heat conduction part is consisted of a plurality of heat conduction particles(11a) which is aligned to the thickness direction. The resilient material(12) is filled up between the conduction part and the conduction part.;COPYRIGHT KIPO 2010
机译:目的:提供一种传热片及其制造方法,以通过将导热部分均匀地布置在间隙中来改善导热特性。;构成:在半导体器件和散热器之间布置一个传热片(10)。 。传热片将半导体器件的热传递到散热器。散热器将由半导体器件产生的热量迅速散发到外部。导热部分在垂直于厚度方向上彼此分开。导热部排成一列。导热部由在厚度方向上排列的多个导热粒子(11a)构成。在导电部分和导电部分之间填充了弹性材料(12)。; COPYRIGHT KIPO 2010

著录项

  • 公开/公告号KR20090126571A

    专利类型

  • 公开/公告日2009-12-09

    原文格式PDF

  • 申请/专利权人 LEE JAE HAK;

    申请/专利号KR20080052722

  • 发明设计人 LEE JAE HAK;

    申请日2008-06-04

  • 分类号H01L23/34;H05K7/20;

  • 国家 KR

  • 入库时间 2022-08-21 18:33:55

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