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LIGHT EMITTING DIODE PACKAGE HAVING A DOME TYPE ENCAPSULATION LAYER AND A METHOD FOR FABRICATING THE SAME, CAPABLE OF CONTROLLING FLOW OF SEALED FLUID BY FORMING UNEVEN PART
LIGHT EMITTING DIODE PACKAGE HAVING A DOME TYPE ENCAPSULATION LAYER AND A METHOD FOR FABRICATING THE SAME, CAPABLE OF CONTROLLING FLOW OF SEALED FLUID BY FORMING UNEVEN PART
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机译:具有圆顶型封装层的发光二极管封装及其制造方法,能够通过形成不均匀部分来控制密封流体的流动
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摘要
PURPOSE: A light emitting diode package having a dome type encapsulation layer and a method for fabricating the same are provided to protect a light emitting diode chip by forming a domed passivation layer high according to block of the dispersion of a sealed fluid.;CONSTITUTION: In a device, a package substrate(11) includes a peripheral area that surrounds an element area and the element area. Bonding pads(21,22) are formed on the element area of the package substrate. A heat sink(30) is arranged at the bottom of the package substrate. Housing(12) having a cavity is arranged on the peripheral area of the package substrate. A concavo-convex region(50) is formed on the housing. The concavo-convex region includes a plurality of protrusions(51,52,53,54) which surrounds the element area. A light emitting diode chip(40) is arranged at one among bonding pads exposed within the cavity. The domed sealed layer(60) is formed by dotting fluid on the light emitting diode chip.;COPYRIGHT KIPO 2010
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