PURPOSE: encapsulating device is provided to improve reliability detection semiconductor and failure rate, by examining all semiconductor films to coat sealant. ;CONSTITUTION: in a device, semiconductor film, the semiconductor film (10) is mounted on bracket (110). Semiconductor devices is mounted on semiconductor film. Distributor (120) is located at the support of semiconductive thin film. Distributor extends the semiconductor film of predetermined sealant. Single side measuring unit (130) measures cross-section sealant and smears semiconductor film. Single side measuring device extends predetermined epoxy resin. Single side measuring unit measures section and smears sealant. Single side measuring unit includes controller, it decides the cross-sectional shape of admissibility. Semiconductor film supporting member is mounted on the bottom of single side measuring instrument, so that it can be moved forward and backward. ;The 2010 of copyright KIPO submissions
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