HARDWARE DEVELOPMENT TO REDUCE BEVEL DEPOSITION

摘要

Embodiment according to the invention relate to various techniques which may be used alone or in combination to reduce or eliminate the deposition of material on the inclined surface of the semiconductor workpiece (882). In one approach, a shadow ring for preventing the flow of gas to the inclined surface region (880) located on the edge of the substrate (882). Geometric feature at the edge (880a) of the shadow ring is said to point to the edge facing the flow of gas to the wafer to maintain thickness uniformity across the wafer. In another approach, the substrate is configured to flow purge gases to the edge of the substrate with a heater / support is supported. These purge gases prevent the material is deposited on the inclined surface area to process gas from reaching the substrate edge. ; Semiconductor, wafer, the inclined surface deposition, hardware development, the shadow ring