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POLARIZED FILM CUTTING METHOD FOR REMOVING PROTECTIVE FILM ATTACHED ON POLARIZATION PLATE AFTER PANEL FRAME ASSEMBLY EASILY AND POLARIZED FILM CUTTING APPARATUS USED IN THE SAME
POLARIZED FILM CUTTING METHOD FOR REMOVING PROTECTIVE FILM ATTACHED ON POLARIZATION PLATE AFTER PANEL FRAME ASSEMBLY EASILY AND POLARIZED FILM CUTTING APPARATUS USED IN THE SAME
PURPOSE: A polarized film cutting method and an apparatus thereof are provided to reduce raw material by using only one protective film until a final assembly process of an LCD panel.;CONSTITUTION: A protective film is attached to a polarizer(S10). A polarized film is cut according to panel size(S20). A removal line is formed in the cut polarized film by cutting only the protective film on the top surface of the polarizer(S30). A delamination zone and central residual zone are partitioned by the removal line. The delamination region is delaminated(S40). The cutting step and the removal line forming step are performed at the same time. A polarized film cutting apparatus includes a first cutter knife, a second cutter knife and a supporting frame. The first cutter knife is as long as to cut the whole polarized film. The second cutter knife is long only to cut the protective film. The first cutter knife and the second cutter knife are vertically attached to the bottom of the supporting.;COPYRIGHT KIPO 2010
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